- NI Technology Identifies Investment Opportunities in Cloud Computing-PRINCETON, N.J., Nov. 6
- Actions Semiconductor Reports Third Quarter 2009 Results-ZHUHAI, China, Nov. 5
- NI Technology Previews Earnings for Nvidia, Atmel, International Rectifier, Semitool and Skyworks Solutions-PRINCETON, N.J., Nov. 5
- Infineon and TSMC Extend Technology And Production Partnership Agreement; Will Jointly Develop 65nm Embedded Flash Process Technology For Automotive and Chip Card Applications-NEUBIBERG, Germany and HSINCHU, Taiwan, R.O.C., No
- NI Technology Previews Earnings for Cisco Systems, Echelon, Qualcomm, Microchip Technology and Towerstream-PRINCETON, N.J., Nov. 4
- Altair Semiconductor Announces Immediate Availability of LTE USB ExpressCard-HOD HASHARON, Israel, Nov. 4
- Novellus Improves Tungsten Resistivity Performance With Advanced LRWxT(TM) Process-SAN JOSE, Calif., Nov. 3
- STMicroelectronics, in Close Cooperation with LG Display, Unveils New Advanced Interface Standard for LCD TVs-GENEVA, Nov. 3
- Dapco improves safety for railroads, pipelines and other critical infrastructure with TI's new six-core DSP-DALLAS and RIDGEFIELD, Conn., Nov. 3
- Nova Announces Record Net Income in the Third Quarter of 2009-REHOVOT, Israel, November 3
- STMicroelectronics Raises Standards in Power Saving, Performance and Time-to-Market for Machine-to-Machine Cellular Connections-GENEVA, Nov. 2
- Advanced Semiconductor Engineering, Inc. Reports Unaudited Consolidated Financial Results for the Third Quarter of 2009-TAIPEI, Taiwan, Oct. 30
- AnalogicTech to Present at TechAmerica AeA Classic Financial Conference-SANTA CLARA, Calif., Oct. 29
- California Micro Devices Reports September Quarter Results-MILPITAS, Calif., Oct. 29
- NI Technology Updates Outlooks for MIPS Technologies, Applied Micro Circuits, EZchip and Motorola-PRINCETON, N.J., Oct. 29
- National Semiconductor CEO Brian Halla Discusses Role of Electronics in World's Initiatives to 'Go Green'-YOKOHAMA, Japan, Oct. 29
- Texas Instruments announces new low power IP camera reference design providing H.264 main profile 1080p at 30 frames per second and 30% performance boost-HOUSTON, Oct. 29
- National Instruments Declares Quarterly Dividend-AUSTIN, Texas, Oct. 27, 2009
- Atmel Schedules Third Quarter 2009 Earnings Release and Conference Call-SAN JOSE, Calif., Oct. 27
- Open-Silicon, MIPS Technologies, and Virage Logic Achieve High Performance ASIC Processor Design-MILPITAS, SUNNYVALE and FREMONT, Calif., Oct. 27
- Trident Microsystems Reports Results for First Quarter of Fiscal Year 2010-SANTA CLARA, Calif., Oct. 26
- NI Technology Previews Earnings for Flextronics, Amkor, Advanced Semiconductor Engineering, Siliconware Precision Industries and Arris Group-PRINCETON, N.J., Oct. 26
- SMIC Announces Successful Qualification of a MEMS Chip for Microstaq-SHANGHAI and AUSTIN, TX, Oct. 26
- STMicroelectronics Boosts STM32 Development with Fast-Start Development Platform-GENEVA, Oct. 23
- SMIC 2009 Technology Symposium Held in Shanghai-SHANGHAI, Oct. 23
- MEMC Reports Third Quarter Results-ST. PETERS, Mo., Oct. 22
- MEMC to Expand Scope of Solar Business with Acquisition of SunEdison-ST. PETERS, Mo. and BELTSVILLE, Md., Oct. 22
- Monolithic Power Systems Announces Results for the Quarter and Nine Months Ended September 30, 2009-SAN JOSE, Calif., Oct. 22
- Cable Set-Top-Box Platform from STMicroelectronics Drives Value-Added Digital-TV Services in China-GENEVA, Oct. 22
- NI Technology Updates Outlooks for Broadcom, Celestica, Juniper Networks, Microvision, PMC-Sierra and Synaptics-PRINCETON, N.J., Oct. 22
- Carsem Announces Extremely Thin MLP-IPOH, Malaysia, Oct. 22
- NI Technology Updates Outlooks for Citrix Systems, EMC, VMware, STEC, F5 Networks and Intersil-PRINCETON, N.J., Oct. 21
- Toshiba Drives Power-Efficient Appliance Design With New Dual-Motor, ARM Technology-Based Microcontroller-SANTA CLARA, Calif., Oct. 21
- Xandex Solar Signs Agreement with DC Power Systems for SunMizer(TM) North American Distribution-PETALUMA, Calif., Oct. 21
- STMicroelectronics Reports 2009 Third Quarter and Nine Month Financial Results-GENEVA, Oct. 20
- Cymer Reports Third Quarter 2009 Operating Results-SAN DIEGO, Oct. 20
- Novellus Systems Launches SABRE(R) Excel(TM) for 22nm Copper Electroplating-SAN JOSE, Calif., Oct. 20
- NI Technology Updates Outlooks for Cree, SanDisk, Corning, STMicroelectonics, and TSMC-PRINCETON, N.J., Oct. 20
- Nova Measuring Instruments Schedules 2009 Third Quarter Results Conference Call for November 3, 2009 at 8:30 am EST-REHOVOT, Israel, October 20
- TI reports financial results for 3Q09-DALLAS, Oct. 19
- SMIC Adopts Cadence DFM Solutions for 65- and 45-Nanometer IP/Library Development and Full Chip Production-SAN JOSE, Calif., Oct. 19
- National Semiconductor Introduces Wireless Basestation IF Sampling Receiver Subsystem-SANTA CLARA, Calif., Oct. 19
- Marvell Semiconductor in Santa Clara to Host Visit by Senior Chinese Government Officials-SANTA CLARA, Calif., Oct. 16
- NeoMagic(R) Corporation Announces New Investors and Board Members-SAN JOSE, Calif., Oct. 15
- Webinar Alert: Real Time Clocks and the Advantages of Using a Stand-alone Version From NXP Semiconductors-SAN JOSE, Calif., Oct. 15
- Colo5 Data Center Achieves Industry Certification Milestone-JACKSONVILLE, Fla., Oct. 14
- NI Technology Updates Outlooks for SanDisk, Micron, Hewlett-Packard and Dell-PRINCETON, N.J., Oct. 14
- STMicroelectronics Expands MEMS Portfolio with Medium-G Accelerometers-GENEVA, Oct. 14
- Multigig Inc. Announces Change in Executive Leadership-SCOTTS VALLEY, Calif., Oct. 13
- Powervation Names Stephen Allen as Vice President of Global Sales-MOUNTAIN VIEW, Calif. and LIMERICK, Ireland, Oct.
- STMicroelectronics Unveils Mobile-Phone 5M-pixel Camera Roadmap Utilizing Latest Innovations in CMOS Image-Sensor Technology-GENEVA, Oct. 13
- SRS TruVolume Heavily Preferred During Side-By-Side Volume Leveling Research Study-SANTA ANA, Calif., Oct. 13
- Texas Instruments to webcast 3Q09 earnings conference call-DALLAS, Oct. 12
- NI Technology Updates Outlooks for Apple, Intel, Altera, Xilinx and MIPS Technologies-PRINCETON, N.J., Oct. 12
- Tower Semiconductor Selected as Preferred Foundry by C&S Technology in Korea for Power Automotive Devices-SEOUL, South Korea and MIGDAL HA'EMEK, Israel, Oct
- NI Technology Updates Outlooks for Qualcomm, NetLogic Microsystems, Microchip Technology and STMicroelectronics-PRINCETON, N.J., Oct. 9
- Ultra Clean Reports Revised Third Quarter Guidance and Announces Earnings Conference Call-HAYWARD, Calif., Oct. 8
- Telegent Systems Founders Honored With HYSTA Entrepreneur of the Year Award-SUNNYVALE, Calif., Oct. 8
- Pressures of Global Software Development Teams Eased With New Electric Cloud Build-Test-Deploy Software-SAN FRANCISCO, Oct. 8
- NI Technology Updates Outlooks for MEMC Electronic Materials, Corning, 3M, Semitool and O2Micro International-PRINCETON, N.J., Oct. 8
- NI Technology Updates Outlooks for Maxim Integrated Products, National Semiconductor, ON Semiconductor, Power Integrations and Texas Instruments-PRINCETON, N.J., Oct. 7
- Atmel Launches Industry's Safest Battery Management Solution for Automotive and Industrial High-Cell-Count Li-Ion Battery Packs-SAN JOSE, Calif., Oct. 7
- Panasonic, World's First Company to Leverage Next-Generation SRS Circle Surround Auto DX-SANTA ANA, Calif., Oct. 6
- NI Technology Updates Outlooks for Analog Devices, Fairchild Semiconductor, International Rectifier, Intersil and Linear Technology-PRINCETON, N.J., Oct. 6
- STMicroelectronics Technology Chosen for Electronic Power Metering in Spain-GENEVA, Oct. 5
- Trident Microsystems and NXP to Combine Digital TV and Set-Top Box Businesses to Create Industry Leader in the Digital Home Market-SANTA CLARA, Calif. and EINDHOVEN, The Netherlands
- ChipMOS UPWARDLY REVISES Q3 2009 GUIDANCE; EXPECTS 13%-15% SEQUENTIAL REVENUE GROWTH-HSINCHU, Taiwan, Oct. 2
- eBeam Initiative Members Collaborate to Enhance Design For e-Beam Throughput-SAN JOSE, Calif., Oct. 1
- NI Technology Updates Outlooks for VMware, EMC, Harmonic and Sun Microsystems-PRINCETON, N.J., Oct. 1
- Oak Ridge National Laboratory Looks to NVIDIA 'Fermi' Architecture for New Supercomputer-SANTA CLARA, Calif., Sep. 30
- mental images Unveils iray Rendering Solution-SANTA CLARA, Calif. and BERLIN, Sept. 30
- Air Products Supplies Nitrogen to NexPower's New PV Facility in Taiwan-LEHIGH VALLEY, Pa., Sept. 30
- Altium and Premier Farnell Announce Distribution Agreement-SYDNEY, Sept. 29
- Video: TI opens world's most advanced analog manufacturing facility in the U.S.-RICHARDSON, Texas, Sept. 29
- Leading Foundry Selects Nova as Provider of Optical CD for 22/32nm Technology Nodes-REHOVOT, Israel, September 29
- National Press Club to Host 'NEWSMAKER' Media Briefing With Chairman of Semiconductor Firm to Discuss Bringing Jobs Back to United States-WASHINGTON, Sept. 28
- NI Technology Updates Outlooks for Apple, Palm, Research in Motion, Google, Motorola and Nokia-PRINCETON, N.J., Sept. 28
- National Semiconductor Introduces Industry's First 65 MHz, 24-Bit Color SerDes Family for Infotainment Displays-SANTA CLARA, Calif., Sept. 28
- Combined Audio Converter/Driver IC from STMicroelectronics Delivers Extra Power and Size Savings for Portable and Home Audio Products-GENEVA, Sept. 25
- NI Technology Updates Outlooks for EZchip Semiconductor, NetLogic Microsystems, Cavium Networks, Qualcomm, and Silicon Laboratories-PRINCETON, N.J., Sept. 25
- SMIC Chooses Kilopass Embedded Non-Volatile Memory (NVM) for Its 65nm and 45nm CMOS Logic Processes-SANTA CLARA, Calif., Sept. 25
- NI Technology Updates Outlooks for Applied Micro Circuits, Broadcom, Marvell Technology Group, and QLogic-PRINCETON, N.J., Sept. 24
- Camtek Announces Signing of Agreement for the Acquisition of SELA - Semiconductor Engineering Laboratories LTD.-MIGDAL HAEMEK, Israel, September 24
- Green Latch Enables Great Power-Saving for Contact-less Magnetic Scrolling Applications-IEPER, Belgium, September 24
- SMIC Selects Virage Logic's AEON(R) Embedded Multi-Time Programmable (MTP) Non-Volatile Memory (NVM) for RFID Applications-FREMONT, Calif. and SHANGHAI, Sept. 23
- Netlist Files Patent Infringement Lawsuit Against Inphi-IRVINE, Calif., Sept. 23
- Texas Instruments announces calculator app now available on App Store-DALLAS, Sept. 23
- Lyrtech Launches the Intelligent Occupancy Sensor, Using Innovative Technologies From Texas Instruments and ObjectVideo-QUEBEC CITY, Sept. 23
- NI Technology Updates Outlooks for PMC-Sierra, TriQuint Semiconductor and Power-One-PRINCETON, N.J., Sept. 23
- Marvell 88DE2710 Video Processor Powers Sony's BDP- CX7000ES 400-disc Blu-ray Disc(TM) MegaChanger-SANTA CLARA, Calif., Sept. 23
- Jordan Valley Announces Delivery of the JVX6200 XRR Metrology Tool to a Leading-Edge HDD (Hard Disk Drive) Manufacturer-MIGDAL HA'EMEK, Israel, Sept. 22
- Merrimac Receives $7.7 Million Order From Military Systems Supplier For Complex Custom RF Assemblies To Be Manufactured Using Merrimac Multi-Mix(R) Technology-WEST CALDWELL, N.J., Sept. 22
- Continental AG Selects Maxwell Technologies' BOOSTCAP(R) Ultracapacitors for Automotive Voltage Stabilization System-SAN DIEGO, Sept. 22
- TI calculator app for the iPhone now available at iTunes App Store-DALLAS, Sept. 22
- STMicroelectronics Names Paul Grimme Corporate VP, General Manager Automotive Product Group-GENEVA, Sept. 22
- NI Technology Updates Outlooks for AT&T, Comcast, Verizon, eBay, and Google-PRINCETON, N.J., Sept. 22
- MEDIA ADVISORY/ALERT: Synopsys First IP Vendor to Demonstrate SuperSpeed USB 3.0 Host, Hub and Device IP in a Single Demonstration-MOUNTAIN VIEW, Calif., Sept. 22
- Vivante Graphics Processing Unit (GPU) Technology Selected by Cavium Networks-SUNNYVALE, Calif., Sept. 22
- Novellus' SOLA(R) Ultra-Violet Thermal Processing System Provides Optimum ULK Film Integration at 32nm-SAN JOSE, Calif., Sept. 22
- ASAT Holdings Limited Announces Intention To Explore Strategic Alternatives-HONG KONG, DONGGUAN, China and MILPITAS, Calif., S
- DVTel launches complete line of IP video security products in under 6 months with TI's comprehensive DM365 reference design-HOUSTON, Sept. 22
- Wireless Monitoring Applications to Get Boost from STMicroelectronics 32-bit MCU/System-on-Chip with Embedded 2.4GHz Radio-GENEVA, Sept. 22
- New TIM Thermal Characterization Tools-SANTA CLARA, Calif., Sept. 22
- Aehr Test Systems Schedules First Quarter Fiscal Year 2010 Earnings Release and Conference Call-FREMONT, Calif., Sept. 21
- LucidPort Delivers the World's First USB 3.0 Storage Device Supporting UAS Protocol-SAN FRANCISCO, Sept. 21
- Toshiba Adds 32nm mSATA and Half-Slim Solid State Drive Modules-SAN FRANCISCO, Sept. 21
- Synopsys Unveils StarRC Custom Parasitic Extraction Solution-MOUNTAIN VIEW, Calif., Sept. 21
- ACL Semiconductors Chairman's Letter to Shareholders:-HONG KONG, Sept. 21
- NI Technology Updates Outlooks for Flextronics, Benchmark Electronics, Celestica, Jabil Circuit and Sanmina-SCI-PRINCETON, N.J., Sept. 21
- Dot Hill Offers Virtual RAID Adapter Technology for AMD's New Server Chipset-CARLSBAD, Calif., Sept. 21
- Supermicro Launches Six-Core Opteron With PCI-E 2.0 Solutions-SAN JOSE, Calif., Sept. 21
- Honeywell Launches New Material to Improve Efficiency, Power Output of Solar Panels-MORRIS TOWNSHIP, N.J., Sept. 21
- New Ultrasound Reference Design From Samplify Systems Simplifies Design-in for Company's Award-Winning SAM1600 Family of Analog/Digital Converters-BOSTON, Sept. 21
- Samplify Systems Announces Distribution Agreement With Silicon Valley Tech to Promote Its SAM1600 Family of ADCs to Korean Wireless Infrastructure Market-BOSTON, Sept. 21
- Texas Instruments' single-chip power management units for portable electronics cut board space in half-DALLAS, Sept. 21
- Phoenix Technologies to Showcase Cutting Edge Technologies for Mobile PCs -- Instant Boot, Anti-Theft and Data Protection Technology, Instant-On/Off and All Day Computing -- at Intel Developer Forum-MILPITAS, Calif., Sept. 21
- Ausra Names Thomas Caulfield as President & Chief Operating Officer-MOUNTAIN VIEW, Calif., Sept. 21
- Advantest Targets New Markets with Terahertz Wave Measurement Technology-TOKYO, Sept. 18
- STMicroelectronics to Demonstrate Leading-Edge Automotive Technology at ITS 2009-GENEVA, Sept. 18
- TechInsights' ESC UK Event Showcases Leading Companies and Technology Trends in the Electronics Industry-SAN FRANCISCO, Sept. 18
- TI increases dividend-DALLAS, Sept. 17
- NI Technology Updates Outlooks for Apple, Flextronics, Adobe Systems, Omniture, and Microvision-PRINCETON, N.J., Sept. 17
- Hybrid DVR from Siemens based on TI DM648 provides highest quality real-time video recording and highly detailed playback-ZUG, Switzerland, Sept. 17
- New DVDO iScan Duo High-Performance Video Processor Incorporates Dual HDMI A/V Outputs-CAMPBELL, Calif., Sept. 16
- ZeroG and Micrium Deliver Wi-Fi to Embedded Designs-SUNNYVALE, Calif., Sept. 16
- Texas Instruments introduces lowest cost DSP development tool at $49 with full emulation capabilities and extensive development environment-HOUSTON, Sept. 16
- Phoenix HyperSpace(TM) to be Bundled With Intel(R) Atom(TM) Processor-Based Motherboards-MILPITAS, Calif., Sept. 16
- LSI Named to 2009 InformationWeek 500-MILPITAS, Calif., Sept. 16
- Nova to Present at the 2009 RedChip Small-Cap Investor Conference-REHOVOT, Israel, September 16
- UMC First to Announce Carbon Footprint Verification on Integrated Circuit Wafers-HSINCHU, Taiwan, Sept. 16
- Aricent and Cavium Networks Collaborate to Provide LTE Evolved Packet Core Solutions-PALO ALTO, Calif., Sept. 16
- Aehr Test Systems Receives Follow-On Order for Its FOX-15(TM) Wafer-Level Burn-In and Test System From Micronas-FREMONT, Calif., Sept. 15
- Toshiba 60V N-Channel High Voltage Power MOSFET for White LED Backlighting-IRVINE, Calif., Sept. 15
- IBM Announces Highest Performance Embedded Processor for System-on-Chip Designs-EAST FISHKILL, N.Y., Sept. 15
- National Instruments Introduces the NI TestStand ATML Toolkit for Automated Test Application Development-AUSTIN, Texas, Sept. 15, 2009
- Texas Instruments' new 12-channel sequencer and system health monitor with power supply margining reduces board space and eases design-DALLAS, Sept. 15
- Sunplus Selects Synopsys as Its Primary EDA Partner-MOUNTAIN VIEW, Calif., Sept. 15
- ChipMOS REPORTS AUGUST 2009 REVENUE-HSINCHU, Taiwan, Sept. 15
- Advanced Energy(R) Introduces a European Version of Solaron(R) 500 kW Photovoltaic Inverter-FORT COLLINS, Colo., Sept. 15
- SiPort IC Brings HD Radio(TM) to Microsoft's Zune HD Portable Media Player-SANTA CLARA, Calif., Sept. 15
- Frost & Sullivan Commends Cryptography Research for Technology Leadership-LONDON, Sept. 15
- STMicroelectronics Unveils 8-bit Microcontrollers; First Implementation of Ultra-Low-Power Technology Platform-GENEVA, Sept. 14
- TI and Enfora expand joint initiatives for intelligent asset management and smart grid solutions-DALLAS, Sept. 14
- Texas Instruments' latest operational amplifier provides industry's lowest noise, distortion and quiescent current-DALLAS, Sept. 14
- TSMC Selects Synopsys HSIM Simulator for Sub-40nm Memory IP Characterization-MOUNTAIN VIEW, Calif., Sept. 14
- Fujitsu Microelectronics Now Shipping Industry's First 3G SAW-less Transceiver: a New Multimode, Multiband UMTS/GPRS/EDGE Solution-SUNNYVALE, Calif., Sept. 14
- Tower Semiconductor Accepted Additional $5.3 Million Orders to Complete its Previously Announced Fundraising-MIGDAL HAEMEK, Israel, September 14
- Ozmo Devices Secures $7.5 Million in Series C Venture Funding-PALO ALTO, Calif., Sept. 14
- Altium Appoints Four New Resellers-SYDNEY, Sept. 11
- Fushi Copperweld Announces Participation in September Investor Conferences-DALIAN, China, Sept. 11
- NI Technology Updates Outlooks for Altera, Xilinx, Analog Devices, NetLogic Microsystems, and PMC-Sierra-PRINCETON, N.J., Sept. 11
- Spreadtrum Communications Schedules Annual Shareholder Meeting for October 21, 2009-SHANGHAI, Sept. 11
- NVIDIA CUDA Drives Innovation in Broadcast and Film Production-AMSTERDAM, Sept. 10
- NI Technology Updates Outlooks for Flextronics, Benchmark Electronics, Celestica, and Cree-PRINCETON, N.J., Sept. 10
- Reportlinker Adds Non-Linear Optical Materials and Applications Report-NEW YORK, Sept. 10
- STMicroelectronics Supports Drive into Interactive Television with Demonstrator Platform for Hybrid Broadcast and Broadband Set-Top Boxes-GENEVA, Sept. 10
- ABRISA Appoints Jim Veler as President/CEO-SANTA PAULA, Calif., Sept. 10
- GainSpan Receives Strategic Investment From In-Q-Tel-LOS GATOS, Calif., Sept 10
- DivX Signs License Agreement With Panasonic for Next-Generation DivX Plus(TM) HD Technology-SAN DIEGO, Sept. 10
- Diguang International is Selected as a Member of Sixth Annual China Semiconductor Lighting Standard Working Group-SHENZHEN, China, Sept. 10
- TI updates third-quarter 2009 business outlook-DALLAS, Sept. 9
- Synopsys Increases Stock Repurchase Authorization to $500 Million-MOUNTAIN VIEW, Calif., Sept. 9
- Advanced Micro-Fabrication Equipment, Inc Prevails in Patent Infringement Suit Filed Against the Company by Lam Research in Taiwan-SHANGHAI, TAIPEI, Taiwan and SAN FRANCISCO, Sept.
- inTEST Corporation to Transfer to The Nasdaq Capital Markets-CHERRY HILL, N.J., Sept. 9
- Texas Instruments Foundation gives $3 million to train math and science teachers at local schools and universities-DALLAS, Sept. 9
- ZigBee RF4CE Specification Available for Download-SAN RAMON, Calif., Sept. 9
- NI Technology Updates Outlooks for EZchip Semiconductor, Chartered Semiconductor, United Microelectronics, Taiwan Semiconductor Manufacturing, and SanDisk-PRINCETON, N.J., Sept. 9
- Synopsys First to Announce DDR3 IP with Support for 2133 Mbps Data Rates and 1.35V DDR3L-MOUNTAIN VIEW, Calif., Sept. 9
- AnalogicTech to Present at Jefferies 3rd Annual Technology Conference-SANTA CLARA, Calif., Sept. 9
- New cost-effective hardware development kit from Texas Instruments enables broad adoption of DOCSIS(R) 3.0 video gateways-AMSTERDAM, Sept. 9
- IIC-China and co-located Components Zone to expand to Wuhan, Chengdu and Dongguan this September-DONGGUAN, China, Sept. 9
- Indian Institute of Technology Kharagpur Receives Charles Babbage Grant From Synopsys-KHARAGPUR, India, Sept. 8
- Micrel Names Micrel Veteran Chris Dingley Vice President, Worldwide Sales-SAN JOSE, Calif., Sept. 8
- Synopsys to Present at the Deutsche Bank 2009 Technology Conference-MOUNTAIN VIEW, Calif., Sept. 8
- ZeroG Wireless Targets Smart Grid Applications With Its Low-Power Embedded Wi-Fi-SUNNYVALE, Calif., Sept. 8
- Former Nokia Senior Executive Joins WiSpry's Board of Directors-IRVINE, Calif., Sept. 8
- Broadcom's New International Cable Set-Top Box SoC Solutions Drive Compelling High Definition TV and Advanced Connectivity-AMSTERDAM, Sept. 8
- NI Technology Updates Outlooks for Corning, Cypress Semiconductor, National Semiconductor, Netezza, Anadigics, ON Semiconductor and Skyworks Solutions-PRINCETON, N.J., Sept. 8
- NVIDIA CUDA Technology Dramatically Speeds Up Facial Recognition in CyberLink MediaShow 5 Digital Photo Application-SANTA CLARA, Calif., Sept. 8
- MEMC Provides Business Update; Announces Consolidation of Wafer Manufacturing Operations-ST. PETERS, Mo., Sept. 8
- Advanced Analogic Technologies Introduces Lowest-Power Load Switch Available for Biometric Security Devices-SANTA CLARA, Calif., Sept. 8
- Nova Announces Acceptance for Additional Stand Alone System From new Memory Customer-REHOVOT, Israel, September 8
- Broadcom Announces High Definition Satellite Set-Top Box SoC Solutions With Integrated MoCA(R) 1.1-AMSTERDAM, Sept. 8
- Broadcom's BCM7405 Set-Top Box Solution Completes Microsoft(R) Mediaroom(TM) Integration-AMSTERDAM, Sept. 8
- Broadcom Becomes World's First to Introduce Single Chip IAD with Integrated ADSL2+, 802.11n and DECT, Enabling Voice, Video, Data, and Wireless Bundled Services-PARIS, Sept. 8
- UMC Reports Sales for August 2009-TAIPEI, Taiwan, Sept. 8
- Kingston Technology First to Ship 2133MHz Memory for Intel Core i5 Platform-FOUNTAIN VALLEY, Calif., Sept. 8
- AU Optronics Corp. Reports August 2009 Consolidated Revenue-HSINCHU, Taiwan, Sept. 7
- Advanced Semiconductor Engineering, Inc. Announces Monthly Net Revenues-TAIPEI, Taiwan, Sept. 7
- Texas Instruments achieves industry's lowest drift with family of high-voltage bipolar DACs-DALLAS, Sept. 4
- Marvell and NuTune Collaborate on New Hybrid NIM for European Integrated Digital Television Sets-BERLIN, Sept. 3
- NVIDIA Delivers Comprehensive OpenCL Support Under Snow Leopard-SANTA CLARA, Calif., Sept. 3
- New Fanless MIPIOS Box Computer from MEN Micro Provides Unprecedented Ruggedization in Mobile and Extreme Applications-AMBLER, Pa., Sept. 3
- CoreFlow Introduces Wafer Singulation System for Crystalline PV Industry-YOQNEAM, Israel, September 3
- Zinwell Selects Broadcom's DTV SoC Solution for Superior Picture Quality, High Performance and Advanced Functionality-BERLIN, Sept. 3
- Tower Semiconductor Raises $16 Million From Institutional Investors-MIGDAL HAEMEK, Israel, September 3
- Waytronx, Inc. to Present at Rodman & Renshaw Annual Global Investment Conference-TUALATIN, Ore., Sept. 3
- Marvell Debuts Family of Single Chip Hybrid Demodulators for Integrated Digital Televisions-BERLIN, Sept. 3
- Marvell and NuTune Collaborate on New Hybrid NIM for European Integrated Digital Television Sets-BERLIN, Sept. 3
- National Semiconductor to Host Annual Shareholder and Analyst Meeting in Santa Clara, California-SANTA CLARA, Calif., Sept. 3
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