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TUNDRA'S SERIAL RAPIDIO RESULTS IN FASTER TIME-TO-MARKET.

Electro Manufacturing • Sept 1, 2005 •

The RapidIO(R) Trade Association (RTA), a membership-based organization dedicated to driving the RapidIO interconnect architecture globally, cited Tundra Semiconductor's launch of the first serial RapidIO development platform, using the Tundra Tsi568A(TM) serial RapidIO switch, to test and perform diagnostics resulting in faster time-to-market for high performance RapidIO-based products.

"This announcement reinforces the news we've had from vendors, partners, and customers -- OEMs -- that RapidIO-based systems need more convenient prototyping platforms," said Iain Scott, executive director of the RapidIO Trade Association. "The Tundra serial RapidIO development platform is an integral development tool for companies creating RapidIO-based components, software, and systems. This prototyping platform clearly demonstrates the breadth of the RapidIO ecosystem as well as a growing need among system designers for more RapidIO development tools."

The Tundra Serial RapidIO development board is a comprehensive design support tool that delivers a low-cost prototyping solution for systems architects, board designers and software developers. The stand-alone card, powered through a standard ATX (Advanced Technology eXtended) supply, can be used in conjunction with off-the-shelf processing and I/O boards to immediately create a "proof of concept" system, an application software development environment, customer demos, or an interoperability testing suite. This platform, a critical development component, will reduce system development time substantially.

For information visit, http://www.tundra.com or send email to info@silicontkx.com.

The RapidIO Interconnect Architecture, designed to be compatible with the most popular integrated communications processors, host processors, and networking digital signal processors, is a high-performance, packet-switched, interconnect technology. It addresses the high-performance embedded industry's need for reliability, increased bandwidth, and faster bus speeds in an intra-system interconnect. The RapidIO interconnect allows chip-to-chip and board-to-board communications at performance levels scaling to 10 Gigabits per second and beyond. Designed specifically to achieve high-performance, low- cost, reliable and scalable system connectivity in embedded, networking, and communications devices, the RapidIO specification is being embraced by communications systems OEMs, computer systems manufacturers and silicon vendors around the world.

About The RapidIO Trade Association

The RapidIO Trade Association and its global members drive the RapidIO interconnect architecture. This ISO-certified, open-standard seamlessly enables the chip-to-chip, board-to-board, control, backplane and data plane interconnections needed in high-performance networking, communications and embedded systems. RapidIO-based products are shipping now, including silicon chips, boards and systems.

For more information, visit http://www.rapidio.org or call 805/341-7269.


COPYRIGHT 2005 Worldwide Videotex Reproduced with permission of the copyright holder. Further reproduction or distribution is prohibited without permission.
Copyright 2005, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.
NOTE: All illustrations and photos have been removed from this article.


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