Inventor of the reverse interconnect process keynotes
PCB East.
by Nargi-Toth, Kathy
ATLANTA -- UP Media Group Inc., parent company of Printed Circuit
Design & Manufacture, announced Joseph Fjelstad, founder and
president of Verdant Enterprises, will deliver the keynote address at
PCB Design Conference East 2007 in Durham, NC, on Oct. 23, at 11 a.m. in
the Durham Marriott at the Civic Center.
Fjelstad's keynote, titled "Robust Environmentally
Friendly Electronics Assembly," will reveal a new electronics
assembly process said to use no solder--eliminating many of the risks
and reliability exposures associated with leadfree solders--and no
conventional circuit boards.
The Reverse Interconnection Process embodies a new sequence of core
processing technologies, and is achieved through direct copper-copper
plateup onto an inverted cast-in-place component-array platform. The
process has demonstrated the conceptual potential for the manufacture of
high-density, high-performance, high-reliability and environmentally
(i.e., RoHS) compliant solutions for products ranging from consumer to
mil-aero applications.
Founder and president of Verdant Electronics, Fjelstad has more
than 35 years of experience in electronics interconnection and packaging
in a variety of capacities, from chemist to process engineer and from
international consultant to CEO.
The keynote is free to attend; however, registration and a badge
are required for admission. To register online or find out more about
the Oct. 21-26 show, visit pcbeast.com.
COPYRIGHT 2007 UP Media Group,
Inc. Reproduced with permission of the copyright holder. Further reproduction or distribution is prohibited without permission.
Copyright 2007, Gale Group. All rights
reserved. Gale Group is a Thomson Corporation Company.
NOTE: All illustrations and photos have been removed from this article.