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Nanotech final finish.

Printed Circuit Design & Manufacture • Sept, 2007 • off the SHELF

Ormecon International introduces a new nanofinish that is only 50 nm thin, and consists of less than 10% silver and over 90% of Ormecon's organic nanometal, according to company sources. The performance is said to be superior to any metal or OSP finish. The company cited several external test results generated by companies like Flextronics. The new process will consume less than 10% of the energy compared to other metal finishes and will save over 90% of raw materials, according to Ormecon.

WHO: Ormecon International

WEB: ormecon.de

[ILLUSTRATION OMITTED]


COPYRIGHT 2007 UP Media Group, Inc. Reproduced with permission of the copyright holder. Further reproduction or distribution is prohibited without permission.
Copyright 2007, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.
NOTE: All illustrations and photos have been removed from this article.


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