Industry market snapshot.(MARKET WATCH)
INDUSTRY MARKET SNAPSHOT
Book-to-bills of various components/equipment.
SEPT. OCT.
Semiconductor equipment (1) 0.98 0.94
Semiconductors (2) . . .
Report: military electronics to slow.(MARKET WATCH)
LOS ALTOS, CA -- The change in the Congressional majority will
likely result in slower growth rates for U.S. military electronics
production. Analyst Ed Henderson (hendersonventures.com) . . .
... But issues 'worked out,' says SIA.(MARKET
WATCH)
SAN JOSE -- Semiconductor Industry Association (siaonline.org)
president George Scalise in March said that consumer confidence
continues to boost semiconductor demand, and is easing worries . . .
Excess inventories remain high, says iSuppli ...(MARKET
WATCH)
EL SEGUNDO, CA -- After increasing its holdings of excess
semiconductors during the first half of the year, the electronics supply
chain finished 2006 with its highest level of end-of-year . . .
February manufacturing orders, production up.(MARKET
WATCH)
TEMPE, AZ -- Economic activity in the manufacturing sector expanded
in February following a decline in January; the overall economy grew for
the 64th consecutive month, ISM reported in March . . .
The defense rests.(MARKET WATCH)
THE DEFENSE RESTS
Trends in the U.S. electronics equipment market (shipments only).
% CHANGE
NOV. DEC. (1) JAN. * . . .
All that glitters.(OUR LINE)
The Oscars came to town on heels of this year's IPC Apex/Expo
trade show. I didn't stay over, but I heard a few people say they
were taking advantage of the timing. For most of us, however, there . . .
Calculating characteristic impedance: when taking measurements or
doing simulations, it's good to anticipate your results ahead
QUESTION FROM SCOTT IN TUCSON, AZ: Everyone says that if you bring
a grounded trace next to a signal line, the impedance of the signal line
will drop. This is because of the proximity of the ground . . .
High-speed, low loss laminate.(CPCA 2007 March 21-23 * Shanghai,
China)
Nelco N4000-13EP 210[degrees]C TG substrate is said to offer an
enhanced performance option that expands the range of the N4000-13
material system within the lead-free assembly market. The . . .
Resist technology.(CPCA 2007 March 21-23 * Shanghai,
China)
In designing the line special attention is given to structuring the
photo resist and the panel. As packaging densities further increase, the
demands on developing and etching technologies are . . .
Imaging system.(CPCA 2007 March 21-23 * Shanghai, China)
The Quasar engine semi-auto exposure system for fast and
"cool" exposures of std PCB soldermasks ink with high
resolution and accuracy at speeds approaching or even exceeding DF and
LPI materials. . . .
Laser machining systems.(CPCA 2007 March 21-23 * Shanghai,
China)
The FP1000 laser machining system was created for high performance
and high volume manufacturing environments. Features include active
pulse shaping for process quality, high-performance motion and . . .
PDS design solution.(PCB DESIGN CONFERENCE WEST 2007 Conference:
March 25-30 * Exhibition: March 27-28, 2007 * Santa Clara, CA)
OptimizePI is a PDS performance analysis, verification and
cost-driven optimization platform with particular emphasis on optimum
selection and placement of decoupling capacitors. Is said to . . .
Design platform.(PCB DESIGN CONFERENCE WEST 2007 Conference:
March 25-30 * Exhibition: March 27-28, 2007 * Santa Clara, CA)
A new electronics design platform comprised of NI Multisim 10.0, NI
Ultiboard 10.0 and NI measurement technology introduces professional
design features including: advanced simulation tools and . . .
Easy-to- use capture property editor.(PCB DESIGN CONFERENCE WEST
2007 Conference: March 25-30 * Exhibition: March 27-28, 2007 *
MakeCAP for Cadence OrCAD Capture is said to be an easy-to-use
environment for populating the Capture Property Editor. It uses a
database linked spreadsheet view where engineers select from . . .
DFM collaboration solution.(PCB DESIGN CONFERENCE WEST 2007
Conference: March 25-30 * Exhibition: March 27-28, 2007 * Santa Clar
vShare is a product lifecycle management toolset that supports DFM
collaboration between PCB design and engineering teams. Provides a
centralized platform with access to important design . . .
Selecting the right final finish for RoHS compliant PCBs:
immersion silver and high temperature OSPs meet the manufacturer's
goa
In order to meet the requirements of RoHS, including the
elimination of lead from electronic components, the printed circuit
board industry is moving away from lead bearing hot air solder . . .
The impact of lead-free processing on interconnect reliability:
lead-free assembly requires a balance between copper, base mater
During the last two years there has been a steady migration toward
lead-free compliant printed circuit boards. The effects of RoHS
compliance have been felt primarily in the areas of PCB . . .
Consumer electronics reign supreme: Asian control of cell phone
and IC substrate production propels growth.(WORLD MARKETS)
For most companies in the PCB industry, 2006 was a terrific year in
spite if the high cost of materials that negatively impacted margins.
The growth came mainly from Asia, which is not too . . .
Converging products, expanding supply chain: change is demanded
to head off further commoditization and ensure future innovation
The iNEMI Roadmap 2007 edition will be available this month,
providing a more global perspective than any previous iteration. During
this roadmap cycle, we consciously targeted participation from . . .
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